Appeal No. 1997-1186
Application No. 08/319,913
semiconductor package which comprises a mounting flag made of
material different from that of the leadframe, and the
mounting flag is not detached from the leadframe. The
examiner’s proposed modification of Hingorany would not have
arrived at the claimed invention because such a modified
device would not have “a mounting flag detachable from a
leadframe.” In addition, the mounting flag (28) in Hingorany
is mounted at the base of the cavity (34) so that additional
support is provided for the mounting flag; therefore, the
mounting flag cannot be secured “in a floating manner” as
called for in the claimed invention.
By the same token, Ishibashi pertains to a semiconductor
pressure sensor (not a differential pressure sensor), the
modification of which as suggested by the examiner would not
have arrived at the claimed invention because the glass base
(32) underneath the sensor die (31) would have prevented a
second pressure, if any, from reaching the sensor die (31).
In the absence of the second pressure, Ishibashi can not
operate as a differential pressure sensor. Moreover, a flag
opening in the mounting flag and a second port for receiving a
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