Appeal No. 1997-2652
Application 08/385,509
material (dielectric layers 15 and 16). Furthermore, we note
that Damon shows that the conductive layer 14 is shaped to
connect certain pins (e.g. 24) and not other pins (e.g. 21).
Therefore, we find that Damon's
panel board 11 meets Appellants' claimed "first printed
circuit board" as defined by Appellants' argument in the brief
and reply brief.
Appellants argue on pages 10 and 13 of the brief
that the Damon wire wrapping pins 17 which passed through the
holes 36
in the substrate 35 and extend through the wire wrap board 11
do not suggest the pins of the first electrical component
which pass through a first and second printed circuit board as
recited in Appellants' claim 10. Appellants further argue on
page 5 of the reply brief that the pins in Damon's arrangement
are not pins of an electrical component but rather are wire
wrapping pins.
We note Appellants' claim 10 recites "first
electrical circuit component having one or more pins each
10
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