Appeal No. 98-1230
Application 08/316,753
Claim 1 is the only independent claim on appeal, and it
reads as follows:
1. A hermetically sealed microelectronic device suitable
for use as a microprocessor or computer chip, comprising:
a substrate wafer having associated electronics and at
least one metal bond pad;
a dielectric layer deposited atop said substrate wafer to
a thickness of at least two microns to form a dielectric/metal
seal including a plurality of signal leads; and
a cover wafer anodically bonded to said dielectric layer
and defining a sealed cavity therebetween to house and protect
said electronics, the dielectric layer having a coefficient of
expansion thermally matched to the coefficients of expansion
of the substrate wafer and the cover wafer and having no
surface variations greater than 1000 Angstroms, whereby said
microelectronic device is packaged in its own container and
hermetically sealed.
The reference relied on by the examiner is:
Mikkor 4,773,972 Sept. 27, 1988
Claims 1 through 4, 8 and 9 stand rejected under 35
U.S.C.
§ 103 as being unpatentable over Mikkor.
Reference is made to the briefs and the answer for the
respective positions of the appellants and the examiner.
OPINION
The obviousness rejection of claims 1 through 4, 8 and 9
is reversed.
2
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