Appeal No. 98-2398
Application No. 08/815,251
the specification. That portion of the specification
indicates that:
[t]he resin binder and the pyrotechnic
material in the ignition droplet 46, as well as
the pyrotechnic material of the main pyrotechnic
charge 48, may comprise any suitable materials
known in the art. In the preferred embodiment
of the invention, the pyrotechnic material in
the ignition droplet 46 is KDNBF (potassium
dinitrobenzofuroxan) at about 80% by volume.
The resin binder in the preferred embodiment is
a single component (i.e., free of a catalyst
added for curing) epoxy based UV-curable
thermoset resin at about 20% by volume. More
specifically, the resin binder in the preferred
embodiment is EMCAST CHIPSHIELD No. 1462, a
blend of epoxy resin (CAS No. 2386-87-0), a
hydroxy oligomer compound, mixed sulfonium
compounds (CAS No. 109037-75-4 and No. 108-32-7)
and mineral fillers (to include CAS No. 67762-
90-7) which is available from Electronics
Materials, Inc. of Breckinridge, Colorado. The
supplier-recommended curing process for this
resin binder comprises ultraviolet irradiation
at 350 ± 30 nm at ambient temperature for 2.0
seconds, followed by a 20 minute dwell at
ambient temperature. The UV curing process can
be performed with any suitable apparatus known
in the art.
Claims 1 through 3, 11 through 13 and 16 stand rejected
under 35 U.S.C. § 103 as being unpatentable over Duguet in
view of "applicant’s admission."
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