Appeal No. 1997-1248
Application 08/480,109
Appellant argues [brief, pages 8 to 9 and Appendix B]
that there is no motivation or suggestion to heat the solder
ball in Satou, and, even if there were, to what degree would
one heat the ball. Appellant further argues [id.] that Satou
does not show the frustum cone structure recited in claim 9.
We find that the Examiner is using Appellant’s disclosure
as a blue print to come up with the structure recited in claim
9. We note that Satou is a highly relevant reference.
However, Satou falls short of the specific structure claimed
in claim 9. Thus, for example, whereas it may be true that
when and if the solder ball were sufficiently heated, the
solder ball would probably bead away from the non-wettable
bottom layer because the latter is non-wettable, the question
is what would motivate one to heat the ball. The Examiner
provides no reasoning for it. Furthermore, the Examiner’s
assertion that Satou shows a substantially frustum cone
structure for the edges of the layers is also unsupportable.
Satou does show a stepped arrangement of the various layers,
but it does not disclose a frustum cone structure. The
Examiner also argues [answer, pages 4] that “the appellant’s
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