Appeal No. 1997-1530
Application 08/485,198
The disclosed invention relates to an interconnect
structure for electrically connecting an infrared detector to
external circuitry. More particularly, the interconnect
structure includes alternating layers of insulating and
conductive materials with vias formed in the insulating layers
to provide electrical connections between the conductive
layers and bond pad terminations. At page 7 of the
specification, Appellants indicate that once the formation of
the interconnect structure is complete, it can be removed from
the processing substrate to provide a freestanding
interconnect.
Claim 16 is illustrative of the invention and reads as
follows:
16. A freestanding interconnect comprising:
(a) a freestanding first electrically insulating layer
previously formed on a substrate, said first layer being of a
material having a coefficient of thermal expansion
substantially the same as said substrate;
(b) an electrically conductive pattern on said first
electrically insulating layer;
(c) a second electrically insulating layer of material
having the same thermal properties as said first layer and
adherent to said first layer; and
3
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