Appeal No. 1997-1530
Application 08/485,198
the structure of the first electrically insulating layer. Our
review of the Hornbeck and Watanabe references reveals no
“first electrically insulating layer” which would meet the
specific limitations set forth in claim 16.
Similarly, we find no disclosure in Hornbeck, or for that
matter in Watanabe, which would meet the claimed requirement
of a second electrically insulating layer which is “adherent
to said first layer.” We do note that the insulating layers
190, 196 in Hornbeck, referred to by the Examiner, are shown
as adhering to each other over at least a portion of their
length in the illustration in Hornbeck’s Figure 8g. However,
it is apparent from the disclosure of Hornbeck that, in the
formation of the final infrared detector structure in which
the resistor stack 144 is suspended over the substrate 142,
the insulating layer 196 is removed. We refer to column 10,
lines 9-12 of Hornbeck which states:
Plasma ash [sic, etch] the third and fourth
photoresist layers 204 and 208 together with the
polyimide layer
196. This completes the chips except for bonding
and packaging.
It is our opinion that, absent any line of reasoning on the
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