Appeal No. 1997-1594
Application No. 08/247,090
layer and includes carbide forming materials such as tungsten
and braze- able material such as copper. See column 4, line
66 through column 5, line 12. The infiltrating alloy includes
copper alloys. See column 5, lines 13-18. Our position is
supported by the specification which discloses tungsten as a
carbide forming element. See page 7, and copper alloys as
brazeable infiltrating materials. See specification, page 8.
Accordingly, we conclude that Chen discloses the elements of
coating diamond particles with an adherent carbide forming
material and brazeable material as required by the claimed
subject matter.
Although porosity is not specifically mentioned, we
conclude that the intermediate product necessarily must be
porous since the alloys disclosed by Chen, including copper-
based alloys infiltrate the assembly of diamond particles.
A compacting step and heating step are performed both by
vibrational packing, see column 5, lines 22-26 and by ”hot
pressing” taught at column 5, lines 38-41. We conclude that
both compacting steps result in diamond particles in the form
of a porous body.
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