Appeal No. 1997-3694
Application No. 08/277,013
BACKGROUND
The invention is directed to a system for mounting electronic parts on a structure such as a
printed circuit board. Claim 1 is reproduced below.
1. A mounting system for mounting an electronic part on a mounting body by
aligning leads of said electronic part with corresponding bonding terminals of said
mounting body, said leads being arranged on four sides of said electronic part, said
system comprising:
positional-data forming means for forming positional data of said leads and said
bonding terminals;
line arithmetic means for calculating, from said positional-data, lead lines
representing rows of said leads of said electronic part and bonding lines corresponding
to said lead lines and representing rows of said bonding terminals;
base-point/base-line arithmetic means for calculating base points and base lines
of said electronic part and of said mounting body, said base lines being calculated as1
diagonal lines of a rectangle defined by said four sides, and said base point being
calculated as an intersection point between said diagonal lines of said rectangle;
position/angle arithmetic means for calculating positional-interrelationship
between base points of said electronic part and said mounting body and intersection
angles between the base lines of said electronic part and said mounting body; and
position/angle control means for controlling interrelationship in position and
angle between said electronic part and said mounting body based on said positional
interrelationship and said intersection angles.
1 In the appendix of claims submitted with the Brief, “lines” is misspelled as “liens.”
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