Appeal No. 1997-3932
Application 08/435,237
DECISION ON APPEAL
This is a decision on appeal under 35 U.S.C. § 134 from
the final rejection of claims 2-12 and 15-20.
We reverse.
BACKGROUND
The invention is directed to three embodiments of an
electronic package for housing semiconductor devices.
Claim 2 is reproduced below.
2. A package for encasing one or more electronic
devices, comprising:
a base component having a first perimeter;
a cover component having a second perimeter of a
size less than said first perimeter; and
a leadframe disposed between and bonded to the
base component and the cover component, said leadframe
having an external portion that extends beyond said
second perimeter, terminates adjacent to said first
perimeter and rigidly adheres to said base component.
The Examiner relies on the following prior art:
Butt 4,839,716 June
13, 1989
Kaiser, Jr. et al. (Kaiser) 4,953,001 August 28,
1990
Kovacs et al. (Kovacs) 5,268,533 December 7,
1993
(filed May 3,
1991)
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