Appeal No. 1997-4415
Application 08/469,990
consideration. Claims 1-9, 17 and 20-22 have been canceled.
The invention involves a method for joining a
semiconductor integrated circuit chip to a chip carrier
substrate and the resulting chip package.
Independent claim 10 is reproduced as follows:
10. A semiconductor chip package, comprising:
a semiconductor integrated circuit chip which includes at
least one chip contact pad;
a chip carrier substrate which includes at least one
carrier contact pad; and
a mechanical and electrical connection between said chip
contact pad and said carrier contact pad, said connection
including a region of solder, Characterized In That
said chip carrier substrate is an organic chip carrier
substrate and said solder region includes material non-
uniformly dispersed within said solder region via solid state
diffusion.
The Examiner relies on the following references:
Minetti 4,332,341 June 1,
1982
Nakao et al. (Nakao) 5,090,609 Feb. 25,
1992
Claims 10-12, 18 and 19 stand rejected under 35 U.S.C. §
103 as being unpatentable over Minetti in view of Nakao.
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