Ex parte LAFONTAINE et al. - Page 2

          Appeal No. 1997-4415                                                        
          Application 08/469,990                                                      

          consideration.  Claims 1-9, 17 and 20-22 have been canceled.                

               The invention involves a method for joining a                          
          semiconductor integrated circuit chip to a chip carrier                     
          substrate and the resulting chip package.                                   
               Independent claim 10 is reproduced as follows:                         
               10.  A semiconductor chip package, comprising:                         
               a semiconductor integrated circuit chip which includes at              
          least one chip contact pad;                                                 
               a chip carrier substrate which includes at least one                   
          carrier contact pad; and                                                    
               a mechanical and electrical connection between said chip               
          contact pad and said carrier contact pad, said connection                   
          including a region of solder, Characterized In That                         
               said chip carrier substrate is an organic chip carrier                 
          substrate and said solder region includes material non-                     
          uniformly dispersed within said solder region via solid state               
               The Examiner relies on the following references:                       
          Minetti                       4,332,341                June  1,             
          Nakao et al. (Nakao)          5,090,609                Feb. 25,             
               Claims 10-12, 18 and 19 stand rejected under 35 U.S.C.                
          103 as being unpatentable over Minetti in view of Nakao.                    


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