Appeal No. 1997-4415
Application 08/469,990
by a different process."
Upon our review of claim 10, we find that Appellants have
set forth a product-by-process claim. However, we note that
the product is not identical to the prior art product as
taught in Minetti. In particular, Appellants' claim 10
recites that said chip carrier substrate is an organic chip
carrier substrate and said solder region includes material
non-uniformly dispersed within said solder region. We note
that Minetti's disclosed chip carrier substrate is an organic
chip carrier substrate but the solder region includes material
uniformly dispersed within the solder region because of the
reflowing of the solder to form the bond. Therefore, we find
that Minetti's product is not identical to the Appellants'
claimed product.
Upon our review of Nakao, we fail to find that Nakao
teaches that all the soldering techniques used with mount
metal type packages may also be used with TAB packages. In
column 5, line 44, through column 7, line 18, Nakao teaches
that a reflow solder bonding technique may be used on both
ceramic and TAB substrates. We fail to find any suggestion in
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