Appeal No. 1998-0096
Application No. 08/518,182
Fujimoto and Saito (JP4-6841), taken alone or in
combination, do not teach or suggest such limitations. The
examiner has relied on Onozaki to provide for the deficiencies
of Fujimoto and Saito (JP4-6841), but has failed to establish
a prima facie case of obviousness. While Fujimoto discloses
that the polymer composite bumps of the integrated circuit
element are pressed onto the substrate pads and the integrated
circuit element is bonded to the substrate with insulating
adhesive therebetween, Onozaki teaches bonding IC metallic
bumps 4 to substrate metallic bumps 7 with conductive adhesive
5 therebetween by heat energy and thermocompression processes.
Onozaki, therefore, does not teach the use of heat energy and
thermocompression processes for bonding insulating adhesive
such as that of Fujimoto. Moreover, Onozaki’s bumps are made
of high melting point metals, such as Cu, Ti, etc. (not
polymer as claimed), and the purpose of Onozaki’s invention is
to prevent the bumps from being crushed during heat energy and
thermocompression processes for sufficiently ensuring the
height of the bonding part (Translation, pages 4 through 6).
Thus, Onozaki teaches away from the use of bumps having a
polymer body which are deformed at the time of bonding as
26
Page: Previous 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 Next
Last modified: November 3, 2007