Appeal No. 1998-0096
Application No. 08/518,182
Accordingly, we do not sustain the obviousness rejection
of claim 8 based on the combination of Fujimoto and Saito
(JP4-6841).
The 35 U.S.C. § 103(a) Rejection of Claim 13 Based on
the Combination of Fujimoto and Saito (JP4-30532),
or in the Alternative, the Combination
Fujimoto, Saito (JP4-6841) and Saito (JP4-30532)
Claim 13, which depends from claim 8, further recites "a
conductive adhesive between said composite bumps and said
integrated circuit input/output pads." Fujimoto and Saito
(JP4-6841), taken alone or together, do not teach or suggest
"a conductive adhesive between said composite bumps and said
integrated circuit input/output pads" (emphasis added). Saito
(JP4-30532)teaches away from the use of bump electrodes having
a polymer body deformed when bonded together. Saito (JP4-
30532) teaches the steps of providing bump electrodes 6 on
substrate
2 (Figure 5) and bringing together the IC element 1 and
substrate 2 so that the bump electrodes contact. The purpose
of the invention in Saito (JP4-30532) is to keep the height of
the projecting electrode bump "constant, and connection is
stable for face down bonding" (Translation, pages 7 and 10).
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