Appeal No. 1998-0096
Application No. 08/518,182
the steps of:
providing a single polymer body on each said
integrated circuit element input/output pad and each
said substrate input/output pad, wherein the cross
section area of said single polymer body. . . has a
circular shape. . . ;
. . . .
bringing together said integrated circuit
element and said substrate so that said composite
bumps contact and are deformed during said contact;
. . . (emphasis added).
Fujimoto does not disclose that the composite bumps
having a polymer body are provided on both "integrated circuit
element input/output pad and substrate input/output pad. . .
," and "the integrated circuit element and said substrate. . .
" are brought together "so that said composite bumps contact
and are deformed during said contact. . ." (emphasis added).
Saito (JP4-6841) does not cure such deficiencies.
Onozaki teaches bonding metallic bumps 4 of the
integrated circuit element to metallic bumps 7 of the
substrate with bonding layer 5 between the metallic bumps by
the process of thermocompression. However, Onozaki’s bumps
are made of high melting point metals, such as Cu, Ti, etc.
(not polymer as claimed), and the purpose of Onozaki’s
34
Page: Previous 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 Next
Last modified: November 3, 2007