Appeal No. 1998-0096
Application No. 08/518,182
"wherein said polymer is polyamic acid polyimide." Fujimoto,
Saito (JP4-6841), and Onozaki, taken singly or together, do
not teach that the polymer is polyamic acid polyimide.
As the examiner stated, Kanakarajan’s disclosure relates
to "a process of manufacturing flexible polyamic acid
polyimide metal-clad laminates for use in flexible printed
circuits and tape automated bonding applications" (Answer,
page 6). As such,
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