Appeal No. 1998-0096
Application No. 08/518,182
invention is to prevent the bumps from being crushed during
bonding for sufficiently ensuring the height of the bonding
part (Translation, pages 4 and 6). Thus, Onozaki teaches away
from the use of polymer bumps which are deformed at the time
of bonding.
In combining Fujimoto, Saito (JP4-6841) and Onozaki, the
examiner has failed to recognize that all of the relevant
teachings of the cited references must be considered in
determining what they fairly teach to one having ordinary
skill in the art. He has picked enough teachings from Onozaki
regarding bonded together the bumps on both the integrated
circuit element and the substrate, ignoring the fact that
Onozaki teaches away from the use of bump electrodes having a
polymer body deformed when bonded together. In our opinion,
the examiner’s proposed modification amounts to an
impermissible hindsight reconstruction of the claimed
invention. Therefore, the examiner has failed to establish a
prima facie case of obviousness.
Accordingly, we do not sustain the obviousness rejection
of claims 9 and 14 based on the combination of Fujimoto and
Onozaki, or in the alternative the combination of Fujimoto,
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