Ex parte KURIHARA - Page 1




                The opinion in support of the decision being entered                  
              today was not written for publication and is not binding                
                               precedent of the Board.                                
                                                            Paper No. 17              

                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                    _____________                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                    _____________                                     
                              Ex parte KENICHI KURIHARA                               
                                    _____________                                     
                                Appeal No. 1998-2878                                  
                             Application No. 08/539,069                               
                                   ______________                                     
                                      ON BRIEF                                        
                                   _______________                                    

          Before HAIRSTON, JERRY SMITH, and LEVY, Administrative Patent               
          Judges.                                                                     
          HAIRSTON, Administrative Patent Judge.                                      

                                 DECISION ON APPEAL                                   
               This is an appeal from the final rejection of claims                   
          7 through 12.                                                               
               The disclosed invention relates to a semiconductor device              
          that has a chip bonded to lead terminals via an insulating                  
          layer.  Each of the lead terminals includes a bonding part                  
          that is                                                                     

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