Appeal No. 1998-2878
Application No. 08/539,069
adhered to the insulating layer, and each of the lead
terminals has a portion that is smaller in width than the
width of the bonding part.
Claim 7 is illustrative of the claimed invention, and it
reads as follows:
7. A semiconductor device comprising: a semiconductor
chip having at least one bonding pad; an insulating
layer selectively formed on said semiconductor chip;
at least
one lead terminal provided for said at least one
bonding
pad, said at least one lead terminal including a
bonding
part adhered to said insulating layer and an inner
lead,
said inner lead having a first portion projecting
from said insulating layer toward said bonding pad
and a second
portion disposed between said bonding part and said
first portion and adhered to said insulating layer;
said second portion extending from said bonding part
in
a first direction toward said first portion with a
width
that is smaller than a width of said bonding part,
and
having a first bent segment on said insulating layer
extending in a second direction perpendicular to
said first direction and a second bent segment on said
insulating
layer extending in said first direction and joining
said first portion; and at least one bonding wire
connecting said at least one bonding pad to said
bonding part of said at least one lead terminal.
2
Page: Previous 1 2 3 4 5 6 7 8 9 10 Next
Last modified: November 3, 2007