Appeal No. 1998-2907
Application No. 08/471,748
a semiconductor die having a movable part in a top face
of the die; and
a cap bonded over the first face so that a void region is
defined between the cap and the part, an outer periphery of
the cap surrounding and sealing the part, wherein the cap is
made of metal.
The prior art references of record relied upon by the
examiner in rejecting the appealed claims are:
Greiff et al. (Greiff) 5,216,490 June. 01, 1993
Roylance et al., "A Batch-Fabricated Silicon Accelerometer,"
IEEE Transactions on Electron Devices, Vol. ED-26, No. 12
(December 1979), pages 1911-17. (Roylance)
Appellants' admitted prior art shown in Figure 1 and discussed
on page 6 of the specification. (AAPA)
Claims 1 through 22 and 24 through 41 stand rejected
under 35 U.S.C. § 103 as being unpatentable over AAPA in view
of Roylance and Greiff.
Reference is made to the Examiner's Answer (Paper No. 17,
mailed February 17, 1998) for the examiner's complete
reasoning in support of the rejection, and to appellants'
Brief (Paper
No. 16, filed December 1, 1997) and Reply Brief (Paper No. 18,
filed March 23, 1998) for appellants' arguments thereagainst.
OPINION
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