Appeal No. 1998-3038
Application No. 08/602,503
Claim 19 is the only independent claim on appeal, and it
reads as follows:
19. A method of fabricating a multi-die assembly,
comprising:
providing a substrate including a plurality of conductors;
attaching at least one active face-down base die to said
substrate in electrical communication
with at least some of said conductors;
securing the back side of at least one active face-up stack die
to said base die; electrically connecting said stack die to at
least one of said conductors;
securing at least one discrete component to at least one of said
stack die, said base die, and
said substrate; and
electrically connecting said at least one discrete component to
at least one of said stack die,
said base die, and said substrate.
The references relied on by the examiner are:
Fogal et al. (Fogal) 5,323,060 Jun. 21, 1994
Rostoker 5,399,898 Mar. 21, 1995
Takiar et al. (Takiar) 5,422,435 Jun. 6, 1995
Kuranaga et al. (Kuranaga) 63-104343 May 9, 1988
(Japanese Patent Application)
Kuroda et al. (Kuroda) 63-179537 Jul. 23, 1988
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