Appeal No. 1998-3038
Application No. 08/602,503
another substrate attached to the stacked chip.” Kuranaga, like
Kuroda, does not “specifically illustrate discrete components” in
the multi-die assembly (final rejection, page 2). Inasmuch as
chip 1a is merely described as an IC chip, and not a substrate,
we agree with appellant (brief, page 7) that “Kuranaga does not
teach or suggest the use of a substrate.” For this reason, we
will hereinafter limit our consideration of the rejection to the
teachings of Kuroda and Fogal.
The examiner relies on Fogal (Figure 5) for a teaching of
mounting discrete components on or adjacent a stacked multi-die
assembly (final rejection, pages 2 and 3). According to the
examiner (final rejection, page 3), it would have been obvious to
the skilled artisan to mount discrete components with the stacked
assembly of Kuroda for “the benefit of increased mounting
efficiency.” We agree. Notwithstanding the fact that Fogal does
not mount chips face down to the substrate (brief, page 7), he
nevertheless teaches (Figure 5) mounting discrete components 75,
76 and 78 on or adjacent a substrate mounted stacked assembly of
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