The opinion in support of the decision being entered today was not written for
publication and is not binding precedent of the Board.
Paper No. 21
UNITED STATES PATENT AND TRADEMARK OFFICE
_____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
_____________
Ex parte HIDEKAZU MATSUURA,
YOSHIHIDE IWAZAKI and
NAOTO OHTA
_____________
Appeal No. 1999-0139
Application 08/542,576
______________
ON BRIEF
_______________
Before KIMLIN, GARRIS and OWENS, Administrative Patent Judges.
OWENS, Administrative Patent Judge.
DECISION ON APPEAL
This is an appeal from the examiner’s final rejection of
claims 1-12, which are all of the claims remaining in the
application.
THE INVENTION
The appellants’ claimed invention is directed toward a
process for making a semiconductor package wherein a
semiconductor chip is bonded to a lead frame by an adhesive
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