Ex parte MIKAGI - Page 1




               The opinion in support of the decision being entered today was not     
               written for publication and is not binding precedent of the Board.     
                                                                 Paper No. 25         
                       UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                     ____________                                     
                          BEFORE THE BOARD OF PATENT APPEALS                          
                                   AND INTERFERENCES                                  
                                     ____________                                     
                                 Ex parte KAORU MIKAGI                                
                                     ____________                                     
                                 Appeal No. 1999-0239                                 
                              Application No. 08/520,003                              
                                     ____________                                     
                                 HEARD: March 22, 2001                                
                                     ____________                                     
          Before HAIRSTON, DIXON, and GROSS, Administrative Patent Judges.            
          GROSS, Administrative Patent Judge.                                         



                                  DECISION ON APPEAL                                  
               This is a decision on appeal from the examiner's final                 
          rejection of claims 1 through 14, which are all of the claims               
          pending in this application.                                                
               Appellant's invention relates to a semiconductor device                
          having a metal interconnection.  Claim 1 is illustrative of                 
          the claimed invention, and it reads as follows:                             
               1.   A semiconductor device having a metal                             
          interconnection, said metal interconnection including:                      
               an insulating film provided on a semiconductor substrate               
          via a diffusion layer;                                                      





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