Appeal No. 1999-0493
Application No. 08/649,504
APPENDIX
1. An electronic assembly comprising:
A. a first electronic component with a first contacting
site;
B. a second electronic component with a second contacting
site;
C. a force bearing member which maintains contact between
the
first contacting site on the first electronic component
and the second contacting site on the second electronic
component, wherein the force bearing member is made of
a
cured composition comprising:
a) an addition curable silicone polymer comprising
an average of at least 2 unsaturated functional
groups per molecule;
b) a crosslinker comprising an average of at least 2
silicone-hydrogen linkages per molecule, wherein,
prior to cure, the ratio of Si-H linkages to
functional groups on the silicone polymer (SiH:F
ratio) is about 1:1 to about 20:1; and
c) a catalyst, wherein said catalyst is present in
an amount sufficient to permit curing of the
composition in less than about 20 minutes at a
temperature of about 30°C.
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