Appeal No. 1999-0725
Application 08/476,475
This is a decision on appeal under 35 U.S.C. § 134 from the
final rejection of claims 1-26.
We reverse.
BACKGROUND
The invention relates to a method of capping a solder ball with
a layer of low melting point metal, as may be understood from claim
1, the sole independent claim, reproduced below.
1. A method of capping a solder ball with at least one layer
of low melting point metal, said method comprises the steps of
(a) forming said solder ball on a substrate,
(b) placing a mask over said solder ball such that said mask
surrounds a portion of said solder ball and such that a portion
of said solder ball is exposed,
(c) depositing at least one layer of a low melting point metal
over said solder ball through said mask, such that at least a
portion of said solder ball has a capping layer of said low
melting point metal, and wherein the melting point of said low
melting point metal is lower than the melting point of said
solder ball.
THE PRIOR ART
The Examiner relies on the following prior art:
Noll 3,512,051 May 12, 1970
Melton et al. (Melton) 5,154,341 October 13, 1992
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