Appeal No. 1999-0725
Application 08/476,475
Rao R. Tummala and Eugene J. Rymaszewski, Section 6.3
Controlled Collapse Chip Connection (C4), Microelectronics
Packaging Handbook (Van Nostrand Reinhold 1989) (hereinafter
Microelectronics).3
THE REJECTION
Claims 1-20 and 22-26 stand rejected under 35 U.S.C. § 103(a)
as being unpatentable over Japanese Patent Publication No. JP
62-117346 ('346 reference) or Noll in view of Appellants' admitted
state of the prior art as shown in figure 6-14(c) of
Microelectronics.
Claim 21 stands rejected under 35 U.S.C. § 103(a) as being
unpatentable over the '346 reference or Noll in view of Appellants'
3 The Examiner states that no date is given for this reference
(Examiner's Answer, p. 3). Appellants cite the date as 1989
(specification, p. 3, line 26). We have determined the publication
date to be December 2, 1988, the copyright registration date to be
December 27, 1988, and the imprint date to be 1989 (in agreement with
Appellants' citation), from the Copyright Office online database (at
"http://www.copyright.gov"). The information is reproduced below,
where DCRE is the date of creation, DPUB is the date of publication,
DREG is the date of registration, and IMPR is the imprint date.
TITL: Microelectronics packaging handbook / edited by Rao R.
Tummala, Eugene J. Rymaszewski; managing editor, Alan
G. Klopfenstein.
IMPR: New York : VanNostrand Reinhold, c1989.
PHYS: 1194 p.
CLNA: VanNostrand Reinhold, a division of International
Thomson Publishing Corporation
DCRE: 1988 DPUB: 2Dec88 DREG: 27Dec88
MISC: C.O. corres.
ECIF: 1/B/L
- 4 -
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 Next
Last modified: November 3, 2007