Appeal No. 1999-0875
Application No. 08/467,353
indicated as directed to allowable subject matter but have
been objected to as depending from a rejected claim.
The invention pertains to a capacitor structure. Claims
12
and 13 read as follows:
12. An integrated circuit device including a body of
solid material, and
means for altering stresses in said body of solid
material, said means for altering stresses including a film
from which a volatile material deposited with said film has
been at least partially removed, said film being bonded to a
portion of at least one of a layer of material, a fill
material and said body of solid material.
13. A device as recited in claim 12, further including
a cavity in said body of solid material,
wherein said film is bonded to a portion of an interior
surface of said cavity.
The references relied upon by the examiner are:
Nakata et al. (Nakata) 4,417,298 Nov. 22, 1983
Kubo et al. (Kubo) 4,432,935 Feb. 21, 1984
Claims 12 and 13 stand rejected under 35 U.S.C. § 103 as
being unpatentable over Nakata in view of Kubo.
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