Appeal No. 1999-0875
Application No. 08/467,353
results in unwanted compressive stresses in layer 10
surrounding the collar 41. Such stresses result in elastic
deformation or strain outward from the trench. To avoid such
stresses, a volume reduction is achieved in collar 41 or in
material 51, or both. Significant volume reduction is
achieved by increasing the amount of hydrogen in the as-
deposited films 41 and 51, and later driving off most if not
all of the hydrogen (dehydrogenation) during heat treatment.
The Prior Art
In Figures 2a and 2b, Nakata discloses a chip type
tantalum capacitor which has an insulation resin frame 21 with
a tantalum capacitor element 1 enclosed in the frame. The
structure includes metal foil terminals 31 and 32, and lead
wires 5a and 5b.
Figs. 5 of Nakata illustrate a process of making the chip
type capacitor. The capacitor element is placed in cavity 11
of resin housing 7.
Kubo discloses a method of producing a titanium-aluminum
alloy porous body for a solid electrolytic capacitor in order
4–
Page: Previous 1 2 3 4 5 6 7 Next
Last modified: November 3, 2007