Appeal No. 1999-1052 Page 4
Application No. 08/604,841
a cover generally parallel to and spaced from the mounting plate, and a cooling chamber
defined by the space between the cover and the mounting plate. The cooling assembly
comprises a liquid cooled section disposed within the cooling chamber through which
coolant can flow for carrying away heat generated by the printed circuit board assembly,
and an air cooled section disposed within the cooling chamber and positioned between
the cover and the liquid cooling section through which air can flow for carrying away heat
generated by the printed circuit board assembly. The claim additionally requires that the
mounting plate include a cooling surface facing into the cooling chamber and a board
mounting surface adapted to receive the printed circuit board assembly.
It is the examiner’s view that Frankeny discloses all of the subject matter recited in
claim 1, considering that “[i]nherently” the entire Frankeny assembly is disposed within a
casing. We do not agree with this conclusion.
Frankeny is directed to a heat sink system for carrying away the heat generated by
printed circuit devices by means of liquid and air cooling. However, this is where the
similarity with the system recited in claim 1 ends. Using the language of claim 1 as a
guide, Frankeny fails to disclose or teach that the cold plate includes a mounting plate
having a board mounting surface adapted to receive a printed circuit board assembly
thereon. In the reference the circuit component is mounted on a separate plate that does
not form part of the cooling system. In this regard, we point out that the patent states that
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