Ex Parte MAJUMDAR et al - Page 2




              Appeal No. 1999-1651                                                                                        
              Application No. 08/775,308                                                                                  


                                                    BACKGROUND                                                            
                     The appellants’ invention relates to a controller for power device and drive                         
              controller for motor.  An understanding of the invention can be derived from a reading of                   
              exemplary claim 41, which is reproduced below.                                                              
                     41. A semiconductor device comprising:                                                               
                            a support member having an upper surface and a lower portion;                                 
                            at least one power device;                                                                    
                            at least one control element for controlling said at least one power                          
                     device;                                                                                              
                            a plurality of first terminals each having a first end and a second                           
                     end, at least one first end electrically connected to said at least one power                        
                     device;                                                                                              
                            a plurality of second terminals each having a first end and a second                          
                     end, the first ends electrically connected to said at least one control                              
                     element;                                                                                             
                            a heat sink having one major surface, said heat sink disposed on                              
                     the lower portion of said support member;                                                            
                            a package comprising an upper package portion joined with said                                
                     support member;                                                                                      
                            said at least one power device, said at least one control element,                            
                     and the first ends of said first and second terminals arranged on the upper                          
                     surface of said support member;                                                                      


                            said package sealing said at least one power device, said at least                            
                     one control element, and said first ends of said first and second terminals;                         
                     and                                                                                                  
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