Ex parte TENG - Page 1




          The opinion in support of the decision being entered today was not written for
          publication and is not binding precedent of the Board.                       
                                                                Paper No. 22           
                      UNITED STATES PATENT AND TRADEMARK OFFICE                        
                                     ____________                                      
                          BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                    
                                     ____________                                      
                               Ex parte MING-CHANG TENG                                
                                     ____________                                      
                                 Appeal No. 1999-1792                                  
                              Application No. 08/879,477                               
                                     ____________                                      
                                       ON BRIEF                                        
                                     ____________                                      
          Before BARRETT, FLEMING and LALL, Administrative Patent                      
          Judges.                                                                      
          LALL, Administrative Patent Judge.                                           



                                  DECISION ON APPEAL                                   
               This is a decision on appeal under 35 U.S.C. § 134 from                 
          the final rejection of claims 1-8, 12, 13, 14-21, 24, and 27-                
          29, which constitutes all the pending claims in the                          
          application.                                                                 
               The invention relates to a method of depositing a metal                 
          layer, aluminum-copper alloy, at two different temperature                   
          ranges and at specified thicknesses which yield unexpectantly                
          improved via resistance.                                                     






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