Appeal No. 1999-2403
Application 08/576,185
14. A method of depositing solder ball connection to input-
output (I/O) pad on a surface of a substrate, comprising the
steps of:
(a) depositing solder in a cavity of a depositor, wherein
said depositor has a protrusion in said cavity,
(b) mating said depositor to said substrate having said I/O
pad such that said solder is in contact with said I/O pad,
(c) reflowing said solder such that a solder ball is formed
between said I/O pad and said protrusion, and a contact surface
is formed between said protrusion and said solder ball,
(d) separating said depositor from said substrate a
sufficient distance to separate said solder ball from said
protrusion, and
(e) reflowing said solder ball such that said contact
surface becomes spherical.
The following reference is relied on by the examiner:
Kushima 4,906,823 March 6,
1990
The following reference is relied on by the Board:
Aulicino 5,658,827 August 19,
1997
(filing date Oct. 31, 1995)
Claims 18-21 stand rejected under the written description
portion of the first paragraph 35 U.S.C. § 112, the examiner
alleging that appellants did not have possession of the claimed
invention in these claims at the time this application was filed.
These claims were added by the amendment filed on June 22, 1998,
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