Appeal No. 1999-2403
Application 08/576,185
semiconductor devices and components as set forth generally at
specification page 2, lines
12-18. This is consistent with the similar discussion at page 8
of the specification as filed at lines 14-22.
It appears to us that the artisan would have found it
obvious within 35 U.S.C. 103 to have separated the depositor from
the underlying substrate receiving the solder balls and performed
a subsequent reheating or reflowing operation as is conventional
in the art to achieve the needed true spherical or complete
solder ball shape as set forth in clauses (d) and (e) of
independent claim 14 on appeal. It is known that eutectic solder
forms spheres when heated on metalized pads. See Aulicino column
1, line 66 to column 2, line 14 and specification page 7, lines
30-34. As indicated earlier, the subject matter of dependent
claims 18-21 was also well known in the art and taught in
Aulicino as noted by us earlier in this opinion as to the
features recited in these claims.
In summary, we have reversed the rejection of claims 18-21
9
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 Next
Last modified: November 3, 2007