Appeal No. 1998-3071
Application 08/477,054
states at lines 3-6 of the abstract that the "interconnect device is fully customizable or
programmable upon the upper surface to accommodate various electrical components
and connectivity to those components." A similar statement is made in Sommerfeldt’s
Summary of the Invention at the bottom of column 2 at lines
64 and 65 which is that "the improved MCM hereof is not only fully programmable on only
the surface layer." We identified certain layers in Sommerfeldt as comprising the claimed
"single sublayer" in the last lines of each independent claim on appeal. These claims
require nothing more.
Finally, we turn our attention to the third point at pages 6 and 7 of the request.
There, appellants alleged that we misapprehended whether Sommerfeldt discloses the
inter pad limitation of independent claims 1, 15 and 24. The context in which we
discussed the inter pad spacing at the top of page 10 is the whole paragraph bridging
pages 9 and 10. The basic premise is that the bonding pads may be connected in any
manner in association with the use of connective links 58 shown in Figures 6 and 7. All of
this is caught up in the context of what we considered to be a chip site as discussed in this
paragraph. All that the claim requires is that a pair of connection pads at one chip site be
separated from the chip connection pads at another site by a space greater than any of the
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