Ex Parte SON et al - Page 6



          Appeal No. 2000-0260                                                        
          Application No. 08/675,865                                                  

          Appellants, “... the subject matter of a claim added to an                  
          application after filing need not be literally described in the             
          specification to satisfy the written description requirement of             
          § 112, first paragraph.”  (Brief, page 9, citing In re Lukach, 442          
          F.2d 967, 969, 169 USPQ 795 (CCPA 1971).  We further agree with             
          Appellants (id.), that “... to interpret what is inherently                 
          described in a specification, the specification must be read                
          through the eyes of one skilled in the relevant art.”                       
               Our review of Appellants’ original disclosure reveals that,            
          while the relative substrate depth relationship of arsenic and              
          phosphorus is not explicitly stated, the ion implantation energy of         
          each is clearly set forth (specification, page 4, lines 20-33).             
          Further, in our view, the evidence provided by Appellants provides          
          clear support for their position that the skilled artisan would             
          recognize and appreciate that the variation of ion implantation             
          energy results in a variation of the depth that doping ions                 
          penetrate into a substrate, i.e., the greater the energy, the               
          greater the penetration depth.  As set forth in the Wolf and Tauber         
          document2 (presented by Appellants in the December 23, 1997                 
          amendment and attached as Appendix B to Appellants’ Brief), the             

               2 S. Wolf and R.N. Tauber, “Silicon Processing for the VLSI Era,”      
          Process Technology, Vol. 1, page 290 (1986).                                
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