Appeal No. 2000-0314
Application No. 08/944,192
photoimageable dielectric layer. A metallization pattern
separates each of the dielectric layers from the central core
substrate. Vias are formed in the photoimaged dielectric
layer by a photoimaging process, and vias are formed in the
non-photoimageable dielectric layer by a laser drilling
process.
Claims 1 and 15 are illustrative of the claimed
invention, and they read as follows:
1. A multi-layer printed circuit board, comprising:
a central core substrate having first and second
major opposing surfaces containing first and second
respective metallization patterns;
a photoimaged dielectric layer deposited on the
first surface and overlying the first metallization
pattern, said photoimaged dielectric layer containing a
third metallization pattern and photoimaged vias that
electrically connect the third metallization pattern to
the underlying first metallization pattern; and
a non-photoimageable dielectric layer deposited on
the second surface and overlying the second metallization
pattern, said non-photoimageable dielectric layer
containing a fourth metallization pattern and laser-
formed vias that electrically connect the fourth
metallization pattern to the underlying second
metallization pattern.
15. A multi-layer printed circuit board comprising:
a photoimaged dielectric layer on one side of a
cental core substrate and a non-photoimaged dielectric
2
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Last modified: November 3, 2007