Appeal No. 2000-0422
Application 08/864,044
1. An electrical device comprising:
a metal substrate having a micro roughened surface;
a layer of electrically conducive thermoset adhesive of a
thickness of at least about 0.5 mils and no greater than about 2
mils bonded to said micro roughened surface of said metal
substrate; and
a component having a conductive ground plane coating and a
surface topography associated therewith up to 4 mils height
variation bonded to said adhesive to form an essentially void
free and thin bondline relative to said surface topography.
The Examiner relies on the following references:
Iliou et al. (Iliou) 4,616,413 Oct. 14, 1986
Kukanskis (Kukanskis) 5,037,482 Aug. 6, 1991
Claims 1 and 5 stand rejected1 under 35 U.S.C. § 103(a) as
being unpatentable over Iliou in view of Kukanskis.
Rather than repeat the arguments of Appellants and the
Examiner, we make reference to the brief (paper no. 11), reply
brief (paper no. 14) and the Examiner’s answer (paper no. 13) for
the respective details thereof.
OPINION
We have considered the rejections advanced by the Examiner
and the supporting arguments. We have, likewise, reviewed the
Appellants’ arguments set forth in the briefs.
1 The drawing of the Appellants’ disclosure does not seem
to satisfy the requirement of 37 CFR 1.83(a).
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