Appeal No. 2000-0469 Page 2
Application No. 08/936,321
The only independent claim 1 present in the application is reproduced as follows:
1. A grid array interconnect structure for use in interconnecting a high density multichip
interconnect decal or land grid array package having a plurality of interconnect pads to a printed wiring
board having a plurality of input/output pads, said interconnect structure comprising:
double-sided nonconductive transfer tape having adhesive disposed on both sides thereof, and
having conductive epoxy interconnects formed therethrough that are configured to connect to the
interconnect pads of the high density multichip interconnect decal, or the land grid array package, the
input/output pads of the printed wiring board.
References
The references relied on by the Examiner are as follows:
Shreeve et al. (Shreeve) 5,046,953 Sep. 10, 1991
Cranston et al. (Cranston) 4,902,857 Feb. 20, 1990
Rejections at Issue
Claims 1-5 stand rejected under 35 U.S.C. § 103 as being unpatentable over Shreeve and
Cranston.
Rather than repeat the arguments of Appellant or the Examiner, we make reference to the
Briefs and the Answer for the respective details thereof.1
OPINION
After a careful review of the evidence before us, we do not agree with the Examiner that claims
1 through 5 are unpatentable under 35 U.S.C. § 103 over Shreeve and Cranston.
1Appellant filed an Appeal Brief on May 24, 1999. Appellant then filed a Reply Brief on
September 14, 1999. The Examiner mailed an Office communication on November 24, 1999 stating
that the Reply Brief has been entered.
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