Appeal No. 2000-0469 Page 5
Application No. 08/936,321
Upon careful review of Cranston, we find that Cranston does not teach the “double-sided
nonconductive transfer tape having adhesive disposed on both sides thereof, and having conductive
epoxy interconnects formed therethrough ” as recited in Appellant’s claim 1. Rather, we find that
Cranston discloses “a polymer matrix 18 comprised of an [sic, a] sheet or slab of adhesive epoxy ...”
See Cranston column 3 lines 12-14. Further we find Cranston discloses that “[p]rior to partial curing
of the matrix 18, a plurality of conductive particles 20, typically nickel or glass spheres 22 ... which are
coated with a solder 24, are dispersed throughout the matrix.” See Cranston column 3 lines 21-25.
Furthermore we find that Cranston discloses that “when the matrix 18, with the particles 20 arranged
therein, is sandwiched between the conductive members 12 and 14, and the matrix is then finally cured,
the solder coating 24 on the spheres 22 will melt. Typically, the solder 24 is an alloy comprised of tin,
lead and bismuth, and either cadmium, thallium and/or indium.” See Cranston column 3 lines 37-44.
Finally we find that Cranston discloses that “[t]he advantage of coating the spheres 22 with the low
temperature melting solder 24 is that when the matrix 18 is finally cured, the solder melts and creates a
metallurgical bond between the members 12 and 14.” (Emphasis added) See Cranston column 3
lines 58-61.
Since we find no teaching of Cranston employing a “double-sided nonconductive transfer tape
having adhesive disposed on both sides thereof, and having conductive epoxy interconnects formed
therethrough”, we find that the rejection of claim 1 as being unpatentable under 35 U.S.C. § 103 over
Shreeve and Cranston cannot be sustained.
Further, we find that claims 2 through 5 are dependent from claim 1 and thereby recite the
above limitation. Therefore, we find that Shreeve and Cranston fail to teach all of the limitations of
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