Appeal No. 2000-0811
Application 08/964,734
placed into each of holes 23 in masking plate 18” (see Figure 1).
The walls of the holes retain and confine the solder balls in
place for the next step of the procedure. The examiner correctly
points out that a similar embodiment is described in the
appellants’ specification in Figures 9 and 10. Additionally, we
find that the appellants’ disclosed embodiment in Figures 6 and 7
also illustrate similar physical confinement of the solder balls.
These embodiments are without the inclusion of an adhesive layer.
The term “removably secure” is not defined in the
specification, which discloses many different ways of forming the
solder balls on a decal, some of which employ an adhesive layer
and some do not. In all instances, however, the solder balls are
confined and precluded from rolling around or off their intended
location on the decal. For example, in the specification on page
13, lines 24-29, it is stated (relative to Figures 6 and 7):
Bosses 612 (on the decal) may comprise a variety of
configurations. For example, bosses 612 may be formed
with a configuration of a frustum, as shown in FIGURE
6, or other suitable configurations that are operable
to retain a solder ball. Bosses 612 should be formed
with a depth sufficient to retain solder balls 114.
For example, in one embodiment, bosses 612 are formed
with a depth of approximately eighty percent the
diameter of solder balls 114. The formation of bosses
612 is illustrated at step 820 in the flow chart shown
in FIGURE 8.
7
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