Appeal No. 2000-0811
Application 08/964,734
With respect to a different embodiment shown in Figure 9, the
specification on page 15, lines 25-26 states:
Apertures 912 are formed with a size and configuration
operable to firmly hold solder balls 114.
We do not see how these other embodiments which do not make
use of an adhesive layer, fail to “removably secure” the solder
balls in some meaningful way. The solder balls are subsequently
transferred from the decal to a substrate and so they are
removable from their initially placed location on the decal.
While in their initially placed location, the solder balls are
confined and precluded from moving away. Thus, the solder balls
were secured before their removal. Claim 1 does not specifically
require securing the solder balls by an adhesive layer. Rather,
when interpreted as broad as the specification reasonably
permits, it includes all the different disclosed manners in which
the solder balls remain confined prior to removal from the decal.
In his answer on page 4, the examiner states that “[s]older
members place[d] in apertures of a plate or sheet will remain in
said apertures during normal processing stages until said solder
members are transferred and soldered to a final substrate.” The
appellants in its reply brief argues that the statement is
incorrect. The appellants state on page 3 of the reply brief:
“Solder balls held in apertures have a tendency to drop out of
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