The opinion in support of the decision being entered today was not
written for publication and is not binding precedent of the Board.
Paper No. 14
UNITED STATES PATENT AND TRADEMARK OFFICE
____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
____________
Ex parte LISA J. JIMAREZ and DAVID N. LIGHT
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Appeal No. 2000-0882
Application No. 08/890,582
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ON BRIEF
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Before JERRY SMITH, GROSS, and BLANKENSHIP, Administrative Patent
Judges.
GROSS, Administrative Patent Judge.
DECISION ON APPEAL
This is a decision on appeal from the examiner's final
rejection of claims 1 through 12 and 14 through 22, which are all
of the claims pending in this application.
Appellants' invention relates to a printed circuit board and
metal back plate connected via a bonding layer. The bonding
layer is formed of a conductive metal dispersed in an adhesive
polymer, and the conductive metal has an EMF of less than zero
volts. Claim 1 is illustrative of the claimed invention, and it
reads as follows:
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