Appeal No. 2000-0882
Application No. 08/890,582
1. A printed circuit board assembly comprising:
a) a printed circuit board comprising a dielectric
substrate, a first metallic layer disposed on one opposing face
of said substrate, and a second metallic layer disposed on
another opposing face of said substrate;
b) a metal back plate having a connection surface; and
c) a bonding layer bonding the second metallic layer of
said printed circuit board to the connection surface of said
metal back plate; said bonding layer comprising an adhesive
polymer and a conductive metal having an EMF of less than zero
volts, said conductive metal being dispersed throughout said
polymer; said conductive metal being present at a weight of from
about 45% to about 90% by weight of the total bonding layer
weight; said polymer selected from the group consisting of an
acrylic polymer, an epoxy-based polymer and a thermoplastic
polymer.
The prior art references of record relied upon by the
examiner in rejecting the appealed claims are:
Iliou et al. (Iliou) 4,616,413 Oct. 14, 1986
Capote et al. (Capote) 5,538,789 Jul. 23, 1996
Claims 1 through 12 and 14 through 22 stand rejected under
35 U.S.C. § 103 as being unpatentable over Iliou in view of
Capote.
Reference is made to the Examiner's Answer (Paper No. 13,
mailed December 22, 1999) for the examiner's complete reasoning
in support of the rejection, and to appellants' Brief (Paper
No. 12, filed October 25, 1999) for appellants' arguments
thereagainst.
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