Ex Parte HOWARD - Page 3



          Appeal No. 2000-0937                                                        
          Application 08/959,620                                                      

          arguments set forth in the briefs along with the examiner’s                 
          rationale in support of the rejection and arguments in rebuttal             
          set forth in the examiner’s answer.                                         
          It is our view, after consideration of the record before                    
          us, that the disclosure of Sudo does fully meet the invention as            
          recited in claims 1-9.  We reach the opposite conclusion with               
          respect to claims 23-32.  Accordingly, we affirm-in-part.                   
          Anticipation is established only when a single prior art                    
          reference discloses, expressly or under the principles of                   
          inherency, each and every element of a claimed invention as well            
          as disclosing structure which is capable of performing the                  
          recited functional limitations.  RCA Corp. v. Applied Digital               
          Data Systems, Inc., 730 F.2d 1440, 1444, 221 USPQ 385, 388 (Fed.            
          Cir.); cert. dismissed, 468 U.S. 1228 (1984); W.L. Gore and                 
          Associates, Inc. v. Garlock, Inc., 721 F.2d 1540, 1554, 220 USPQ            
          303, 313 (Fed. Cir. 1983), cert. denied, 469 U.S. 851 (1984).               
          The examiner indicates how he reads the claimed invention                   
          on the disclosure of Sudo [answer, pages 3-5].  With respect to             
          claims 1-9, which stand or fall together [brief, page 4],                   
          appellant argues that Sudo does not teach that the edges of the             
          layer of conductive material on the sides of the container are              
          recessed slightly below the upper surface of the substrate.                 
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