Appeal No. 2000-1787
Application No. 08/646,735
disposed on a main area and having at least one test point
disposed on an auxiliary area, (b) testing the PCB, and
(c) removing the auxiliary area.
As determined by the examiner (answer, page 4), the Hargis
reference discloses manufacturing a printed circuit board
inclusive of the method steps of appellants' claim 1. On the
other hand, appellants point out that claim 1 addresses a printed
circuit board and argue that Hargis does not pertain to printed
circuit boards or their manufacture and does not teach removal
after testing (main brief, pages 6 through 10).
As we see it, one skilled in the art would view the arrays
(of individual packaging substrates) in the testing procedure of
Hargis, using any desired fired or unfired substrate for ceramic
packages or parts with a metallized pattern of internal and
external terminals, metallized traces, and electrical contact pad
thereon (column 3, lines 19 through 68), as denoting the broadly
recited manufacture of a "printed circuit board" as in
appellants' claim 1. Further, it is quite apparent to us that
one versed in the art would assess from the overall teaching of
Hargis that the separable (snap apart) individual electronic
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