Appeal No. 2000-1804
Application 08/668,598
providing a wood composition board;
providing an organic solvent soluble, further curable resin consisting essentially
of:
a ladder organosilsesquioxane polymer of the formula:
wherein R and R’ may be the same or different and are selected from the group
consisting of:
a) aliphatic hydrocarbons of 1-4 carbon atoms;
b) a phenyl radical;
c) a phenyl radical substituted with hydroxy or halogen groups: and
d) halogen groups, provided that R and R’ are not both halogens; w, x, y, and z
are functional groups selected from the group consisting of alkoxy groups of 1-4 carbon
atoms, halogen atoms, hydroxyl groups and silanol groups, and n is an integer ranging
from 10-200, and
optionally including a curing catalyst, inert elements, dyes, coloring agents or
fillers;
coating or impregnating said wood composition board with said organic solvent
soluble, further curable resin; and
curing said organic solvent soluble, further curable resin to reduce the
penetration of water therethrough.
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Last modified: November 3, 2007