Ex Parte SANDER et al - Page 5



          Appeal No. 2000-2100                                                        
          Application No. 09/101,371                                                  

               the art at the time the invention was made to modify the               
               integrated circuit of the prior art with the                           
               symmetrically arranged bond wires of Masuda to reduce                  
               electromagnetic induction.                                             
               Appellants argue inter alia (brief, pages 16 and 17) that “to          
          state that one of ordinary skill in the art would be motivated to           
          modify the integrated circuit of the prior art with the wires of            
          Masuda et al. in order to reduce electromagnetic induction does not         
          make sense since electromagnetic induction has no effect on direct          
          current resistance, only on alternating current impedance,” and             
          that the skilled artisan when confronted with the problem of trying         
          to achieve reduced on-state DC resistance in either power MOSFETs           
          or power bipolar transistors would not have turned to Masuda’s              
          teaching of reducing electromagnetic induction in an oscillator             
          circuit.  Appellants also argue (brief, page 17) that “[a]lthough           
          Masuda et al. may teach a symmetrical arrangement, no teaching or           
          suggestion is given that the bond wires 10 themselves are in fact           
          of symmetrical or the same shape” or that they carry equal current          
          values.  With respect to the examiner’s inherency position,                 
          appellants argue (reply brief, page 3) that Masuda “in no way               
          teaches or suggests that there is uniform current in bond wires             
          between . . . an IC and a SAW element arranged near the IC,” and            


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