Appeal No. 2000-2181
Application No. 08/966,229
formed on the other of the two parallel sides of the
semiconductor substrate.
Claim 1 is illustrative of the claimed invention, and it
reads as follows:
1. A thin-film magnetic head having a head face and a
magnetic layer structure which is arranged on one of two
parallel sides of a semiconductor substrate, wherein the
semiconductor substrate is provided with an integrated
circuit, characterized in that the semiconductor substrate
is secured to a carrier body by means of a securing layer
between the other of said two parallel sides and the carrier
body.
The references relied on by the examiner are:
Daughenbaugh et al. (Daughenbaugh) 4,317,147 Feb. 23, 1982
Lazzari 4,809,103 Feb. 28, 1989
Lin et al. (Lin) 5,506,737 Apr. 9, 1996
Zieren et al. (Zieren) 5,513,057 Apr. 30, 1996
Sundaram 5,710,683 Jan. 20, 1998
(filed Apr. 18, 1996)
Claims 1, 3, 4, 11 through 13, 17 and 18 stand rejected
under 35 U.S.C. § 103(a) as being unpatentable over Lin in view
of Sundaram.
Claims 2 and 20 stand rejected under 35 U.S.C. § 103(a) as
being unpatentable over Lin in view of Sundaram and Lazzari.
Claims 11 and 14 stand rejected under 35 U.S.C. § 103(a) as
being unpatentable over Lin in view of Daughenbaugh.
Claims 15 and 16 stand rejected under 35 U.S.C. § 103(a) as
being unpatentable over Lin in view of Daughenbaugh and Lazzari.
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