Ex Parte JOHNSON - Page 2




            Appeal No. 2001-0297                                                                              
            Application No. 09/196,375                                                                        


                                               BACKGROUND                                                     
                   Appellant's invention relates to a bipolar transistor with a high breakdown voltage        
            collector.  The transistors are used in combination for both high speed operation and for         
            large drive currents on the same monolithic integrated circuit.  An understanding of the          
            invention can be derived from a reading of exemplary claim 3, which is reproduced                 
            below.                                                                                            
                   3.    An integrated circuit, comprising:                                                   
                         a first transistor including:                                                        
                         a first doped buried region within a semiconductor body, said first                  
                   doped buried region including a portion having a first thickness and a                     
                   portion having a second thickness, said first thickness being less than                    
                   said second thickness;                                                                     
                         a first collector region disposed over said buried region;                           
                         a first base region with said collector region; and                                  
                         a first emitter region within said base region;                                      
                         said first collector, said first base region and said first emitter region           
                   being disposed over said buried region having a first thickness and at                     
                   least said first emitter region and said first base region extending over                  
                   said portion having a second thickness; and                                                
                         a second transistor including:                                                       
                         a second doped buried region with said semiconductor body, said                      
                   second doped buried region being substantially uniform in thickness;                       
                         a second collector region over said second buried region;                            
                         a second base region within said second collector region; and                        
                                                      2                                                       





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